DUBLIN--(BUSINESS WIRE)--Oct 2, 2019--

The Asia Pacific semiconductor manufacturing equipment market accounted for US$ 46.44 Bn in 2018 and is expected to grow at a CAGR of 5.7% over the forecast period 2019-2027, to account for US$ 79.04 Bn in 2027.

The increasing adoption of smart electronic devices is boosting the manufacturing prospects, and significant incorporation of electronics in automotive applications is one of the key drivers that is propelling the growth of the semiconductor manufacturing equipment market.

Moreover, the integration of IoT, artificial intelligence, and connected devices across various end-use verticals is expected to boost the semiconductor manufacturing equipment market growth in the forecast period. However, the dynamic nature of technologies requires several changes in manufacturing equipment is anticipated to hinder the semiconductor manufacturing equipment market growth. Asia-Pacific has become a global manufacturing hub with the presence of diverse manufacturing industries.

Further, the governments of these countries are making developments to improve investment scenario. The governments are providing tax-rebates, funds, subsidies, and other such support to attract the manufacturing companies to set-up plants in their respective countries.

Further, several governments have taken initiatives such as Made in China 2025 and Make in India, among others to flourish the growth of manufacturing and other high-tech industries. The high growth in semiconductor manufacturing equipment market is driven by high demand for more semiconductor applications in automotive, industrial, consumer goods, and other electronic products including wireless, storage products.

The significant portion of revenue contribution in the fabrication of semiconductor products is played by memory chips and sensors used in various applications. The semiconductor manufacturing equipment market players are focusing on multiple initiatives to enhance their capabilities and boost its position in the market.

Some of the players present in semiconductor manufacturing equipment market are:

  • Advantest Corporation
  • Applied Materials, Inc.
  • ASML Holding N.V.
  • Hitachi High-Technologies Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Rudolph Technologies, Inc.
  • Screen Holdings Co., Ltd.
  • Teradyne Inc.
  • Tokyo Electron Ltd.

Key Topics Covered:

1. Introduction

2. Key Takeaways

3. Asia Pacific Semiconductor Manufacturing Equipment Market Landscape

3.1 Market Overview

3.2 Market Segmentation

3.3 PEST Analysis

3.3.1 Asia Pacific - PEST Analysis

4. Semiconductor Manufacturing Equipment Market - Key Industry Dynamics

4.1 Key Market Drivers

4.1.1 Increasing Adoption of Smart Electronic Devices Boosting the Manufacturing Prospects

4.1.2 Significant Incorporation of Electronics in Automotive Applications Is Driving the Quest for Semiconductor Manufacturing

4.2 Key Market Restraints

4.2.1 Dynamic Nature of Technologies Require Respective Changes in Manufacturing Equipment

4.3 Key Market Opportunities

4.3.1 Incorporation of IoT, Artificial Intelligence, and Connected Devices across Various End-Use Verticals

4.4 Future Trends

4.4.1 Emerging Packaging Technologies in the Manufacturing Equipment

4.5 Impact Analysis Of Drivers And Restraints

5. Semiconductor Manufacturing Equipment Market - Asia Pacific Analysis

5.1 Overview

5.2 Asia Pacific Semiconductor Manufacturing Equipment Market Revenue and Forecasts to 2027 (US$ Mn)

6. Asia Pacific Semiconductor Manufacturing Equipment Market Revenue And Forecasts To 2027 - Equipment Type

6.1 Overview

6.2 Asia Pacific Semiconductor Manufacturing Equipment Market Breakdown, By Equipment Type,2018 & 2027

6.3 Wafer Manufacturing Equipment

6.3.1 Overview

6.3.2 Wafer Processing Equipment Overview

6.3.3 Inspection and Metrology Equipment & Others Overview

6.3.4 Asia Pacific Wafer Manufacturing Equipment Market Revenue and Forecasts to 2027 (US$ Mn)

6.4 Assembly & Packaging Equipment

6.4.1 Overview

6.4.2 Dicing Equipment Overview

6.4.3 Bonding Equipment Overview

6.4.4 Packaging Equipment Overview

6.4.5 Test, Evaluation & Other Assembly Equipment Overview

6.4.6 Asia Pacific Assembly & Packaging Equipment Market Revenue and Forecasts to 2027 (US$ Mn)

6.5 Test Equipment

6.5.1 Overview

6.5.2 Automated Test Equipment Overview

6.5.3 Prober Equipment Overview

6.5.4 Handler Overview

6.5.5 Other Inspection Equipment Overview

6.5.6 Asia Pacific Test Equipment Market Revenue and Forecasts to 2027 (US$ Mn)

6.6 Others

7. Asia Pacific Semiconductor Manufacturing Equipment Market Revenue And Forecasts To 2027 - Dimension

7.1 Overview

7.2 APAC Semiconductor Manufacturing Equipment Market Breakdown, By Dimension, 2018 & 2027

7.3 2D market

7.4 2.5D Market

7.5 3D Market

8. Asia Pacific Semiconductor Manufacturing Equipment Market Revenue And Forecasts To 2027 - End-Use

8.1 Overview

8.2 APAC Semiconductor Manufacturing Equipment Market Breakdown, By End Use, 2018 & 2027

8.3 Semiconductor Fabrication Plant/Foundry

8.4 Semiconductor Electronics Manufacturing

8.5 Testing Home

9. Asia Pacific Semiconductor Manufacturing Equipment Market Revenue And Forecasts To 2027 - Country Overview

10. Industry Landscape

10.1 Overview

10.2 Market Initiative

10.3 Merger and Acquisition

10.4 New Development

11. Company Profiles

For more information about this report visit https://www.researchandmarkets.com/r/8s35mq

Laura Wood, Senior Press Manager

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KEYWORD: ASIA PACIFIC

INDUSTRY KEYWORD: TECHNOLOGY SEMICONDUCTOR

SOURCE: Research and Markets

Copyright Business Wire 2019.

PUB: 10/02/2019 06:30 AM/DISC: 10/02/2019 06:30 AM

Copyright Business Wire 2019.