DUBLIN--(BUSINESS WIRE)--Apr 19, 2021--

The Dicing Equipment Market is expected to grow at a CAGR of 10.43% over the forecast period 2021 to 2026. Principal factors encouraging the growth of this market include the growing demand for smart cards, RFID technology, and automotive power ICs, increasing consumer electronics market, an increase in the number of factories, and the inclination of miniaturization and technology migration.

Companies Mentioned

  • Suzhou Delphi Laser Co. Ltd
  • SPTS Technologies Limited (KLA Tencor Corporation)
  • ASM Laser Separation International (ALSI) BV
  • Tokyo Seimitsu Co. Ltd.
  • Neon Tech Co. Ltd
  • Nippon Pulse Motor Taiwan (NPM) Group
  • Panasonic Corporation
  • Plasma-Therm

Key Market Trends

Memory and Logic (TSV) Application to Dominate the Market

  • Companies have been seeking to find a single universal memory that combines the benefits of SRAM, Flash memory, and DRAM. New technologies in memory devices, such as Magnetoresistive random-access memory (MRAM), Phase-change random access memory (PCRAM), and Resistive random-access memory (RRAM), are expected to substitute most of the traditional technologies. This shift in the market has necessitated the change in manufacturing equipment dynamics, forcing equipment providers to develop effective designs for the device manufacturers.
  • As data generation grows significantly, cloud data centers need order-of-magnitude enhancements in the speed and power consumption of the data pathways linking servers and storage systems. PCRAM and ReRAM are fast, low-power, and high-density memories, which can be used as "storage-class memory" to fill the widening price-performance gap between server DRAM and storage.
  • The demand for minimum power consumption, decreasing heat, and increasing smartphone usage in the emerging countries is expected to drive the utilization of DRAM (dynamic RAM) in mobile devices. Furthermore, the evolution of 5G technology, coupled with artificial intelligence (AI) powered mobile applications, demands low-power cellular memory solutions. Networking devices, like servers, CPUs, GPUS by enterprises, and cloud service providers, also provide memory manufacturers opportunities.
  • At the Data Center Investment Conference & Expo South, it was discussed that 4,000 new data centers might be needed to accommodate the data growth and the need for edge computing across the United States, by 2020. With the volume of digital traffic expected to triple over the next five years, the dependency on the data centers is expected to increase significantly, and thus, providing scope for memory ICs for networking devices, like servers.

China to Hold a Major Market Share of the Market

  • The growing adoption of smart electronic devices is encouraging manufacturing prospects. Necessary incorporation of electronics in automotive applications is one of the principal drivers driving the growth of the China Dicing Equipment Market.
  • The integration of artificial intelligence, IoT, and connected devices across multiple end-use verticals is anticipated to encourage the semiconductor manufacturing equipment market growth in the projection period. China has grown a global manufacturing center with the presence of various manufacturing industries.
  • As semiconductor supply chains begin changing due to the US-China trade conflict, India is leveraging the benefit. According to stats from the United Nations Comtrade database, annual IC imports into India in 2018 jumped by 281% to USD 8 billion.
  • According to World Semiconductor Trade Statistics (WSTS) and SIA Estimates, the Asia Pacific region, which includes markets like China, has surpassed all other regional markets in sales, as electronic equipment production shifted to the area. It has multiplied in size since then - from USD 39.8 billion in 2001 to over USD 282 billion in 2018.
  • With the growth in electronic equipment production across the region, the biggest country market across the Asia Pacific region is China. According to the WSTS and SIA Estimates, China is the sole largest country of APAC region, whereby accounting for 56% of the Asia Pacific market and is capturing 34% of the total global market in 2018.
  • According to the SEMI, a notable global association helping the electronics industry's manufacturing supply chain, more than 90% of the factories constructed in the world were located in the Asia Pacific. It is estimated that most of these factories are concentrated in China. With initiatives for Tokyo Olympics 2020 already in motion, the semiconductor manufacturing region is anticipated to open up better possibilities for the dicing equipment shortly.

Key Topics Covered:

1 INTRODUCTION

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET DYNAMICS

4.1 Market Overview

4.2 Industry Attractiveness - Porter's Five Forces Analysis

4.3 Market Drivers

4.3.1 Technological Advancements, and Evolution of Next Generation Devices

4.4 Market Challenges

4.4.1 Mass Manufacturing Challenges

4.4.2 Recent outbreak of COVID-19

4.5 Industry Value Chain Analysis

4.6 Assessment of Impact of Covid-19 on the Industry

5 MARKET SEGMENTATION

5.1 By Dicing Technology

5.2 By Application

5.3 Geography

5.3.1 China

5.3.2 Taiwan

5.3.3 South Korea

5.3.4 North America

5.3.5 Europe

5.3.6 Rest of the World

6 POTENTIAL LIST OF KEY CUSTOMERS FOR DICING EQUIPMENT

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS

For more information about this report visit https://www.researchandmarkets.com/r/cjl7w3

Laura Wood, Senior Press Manager

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KEYWORD:

INDUSTRY KEYWORD: SEMICONDUCTOR HARDWARE NANOTECHNOLOGY OTHER TECHNOLOGY TECHNOLOGY

SOURCE: Research and Markets

Copyright Business Wire 2021.

PUB: 04/19/2021 09:20 AM/DISC: 04/19/2021 09:21 AM

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